高功率飛秒光纖雷射 Jasper X1廠商, 高功率飛秒光纖雷射 Jasper X1台灣代理商公司│維佳科技

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高功率飛秒光纖雷射 Jasper X1

Jasper X1

X1 是一款高效能飛秒雷射系統，專為高要求應用中的最大靈活性與精密度而設計。

產品特色

Jasper X1 是一款高效能飛秒雷射系統，專為高要求應用中的最大靈活性與精密度而設計。其具備延伸式突發脈衝長度，並支援可彈性調整脈衝包絡 (Custom Envelope Burst, CEB)，同時脈衝寬度可調範圍最長達 20 ps。此特性可針對不同材料與應用需求進行精準製程開發與最佳化。

透過先進的 Pulse-on-Demand 技術與奈秒等級抖動控制，Jasper X1 提供卓越的脈衝時序精準度，特別適用於提升加工邊緣品質、角落細部加工效果，以及最大化工作週期 (duty cycle)。本系統採全光纖架構設計 (all-fiber)，且無需半導體可飽和吸收鏡SESAM，確保穩定輸出、長期可靠性與真正免維護的 24 小時全年無休運作能力。

Proven stability & exceptional lifetime with average power of up to 60 W
Maximum pulse energy of up to 200 µJ
< 270 fs – 20 ps pulse tunability
Superior beam quality thanks to all-fiber optical construction
Advanced Pulse-on-Demand and Custom Envelope Burst with bursts of up to 80 pulses
Instantaneous external triggering, providing 100-fold accuracy improvement for the system precision

Model	JX30-100	JX30-200	JX30-200P	JX60-200	JX60-200P
Central Wavelength	1030 ± 5 nm
Average Power	30 W			60 W
Max. Pulse Energy	100 µJ	200 µJ		200 µJ
Nominal Pulse Repetition Rate (PRR)	300 kHz	150 kHz		300 kHz
Pulse Width	< 270 fs
Tuning Range	< 270 fs – 8 ps	< 270 fs – 20 ps
Pulse Repetition Rate (PRR)	Single-Shot to 20 MHz
Pulse-on-Demand	Standard		Advanced	Standard	Advanced
Max. PRR / Jitter	(based on pulse picker)		1 MHz / < 50 ns	(based on pulse picker)	1 MHz / < 50 ns
Max. Burst Energy	100 µJ	300 µJ		400 µJ
No. of Pulses in MHz Burst Mode	2 – 80	2 – 80	2 – 12	2 – 80	2 – 12
Custom Envelope Burst (5)	Optional	Included	–	Included	–
Beam Quality, M2	< 1.2 (1.1 typical)
Beam Circularity	> 87%
Beam Divergence	< 1 mrad
Beam Diameter	2.5 ± 0.5 mm
Polarization, PER	Vertical, PER > 28 dB
Beam Pointing Stability	< 20 µrad/°C
Long Term Power Stability – 100 h	< 0.5%
Pulse-to-Pulse Energy Stability – 24 h	< 1%
Triggering	External / Internal
Pulse Control	Internal / External analog power modulation, Pulse picker, Burst mode, Custom Envelope Burst (CEB)
Options	Harmonic Module – 515 nm, 343 nm, 257 nm (automatic selection). Automated Mechanical Shutter
Cooling	Water
Control Interface	GUI (USB) / SCPI (RS232) / TTL (BNC) / Analog (BNC)
Laser Head Dimensions (L x W x H)	1096 x 446 x 100 mm
Laser Head Weight	50 kg
Power Supply Unit Size (L x W x H)	3U 19” rack unit: 376 x 485 x 133 mm
Power Supply Unit Weight	13 kg
Laser Head Mounting Options	Horizontal / Vertical
Operation Ambient Temperature	15 – 30°C
Relative Humidity	10 – 80% (non-condensing)
Power Consumption	< 620 W
Umbilical	3 m, Detachable (more upon request)
Electrical	100 – 240 V AC, Single Phase 50 – 60 Hz

Micromachining
Microelectronics
Medical device manufacturing
Surface engineering
Material compatibility

Jasper X1.pdf

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